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Every metal layer on a wafer, from M1 at the front end to redistribution for wafer level packaging, requires patterning. Selective material removal, including etching oxides and metals, often becomes...

Global Talent Shortage is a buzzword; everywhere, everybody is using this nowadays. But what does it really mean? The most used definition we could find was: 'Employers cannot find the...

In this viewpoint our Chief Commercial Officer, Peter Dijkstra, looks back at 2022 and forward at 2023. 2022 was another record year for Trymax Semiconductor Equipment B.V.. 2022 was marked for multiple...

At SEMICON Europe 2022, Peter Dijkstra, our CCO, had an interview with Françoise von Trapp from 3D InCites. Conversations range from discussions about this year's event compared to the 2021 show,...

We’re very pleased to inform you that Trymax Semiconductor Equipment B.V. is growing rapidly and therefore we will be moving to a new location. The manufacturing floor, the demo laboratory...

As semiconductor device manufacturers further shrink the size and increase the reliability of packaging devices, plasma treatment is increasingly used for advanced applications during wafer level packaging. For advanced applications Trymax...