The NEO 200A product is the smallest footprint single chamber platform for advanced ashing and etching products from Trymax Semiconductor Equipment.
It’s a fully automated single chamber system that can be configured with any of the currently available Trymax NEO process modules. It’s compatible with substrates up to 200mm in diameter. The small footprint of the NEO 200A is configured with a dual cassette.
- 100 / 150 /200mm substrate size
- Dual cassette platform
- 4 axis dual arm robot handling
- 3 different process chamber technologies available:
- Microwave downstream (2.45 GHz)
- RF bias (13.56 MHz)
- Dual Source (Microwave, RF bias)
- Mechanical throughput >100wph
- Compact footprint
- Very low Cost of Ownership
- Fully digital controlled, devicenet-ethernet
- Windows based industrial computers.
- Bulk resist, post LDI resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon nitride/silicon carbide etch applications
- TaSi etch
- MEMS applications
- Advanced packaging processing (PR, PI, BCB, PBO)
- RF filter BAW/SAW resist processing
- SEMI S2-01
- SEMI S8-01
- CE EU-RoHs
- UL (optional)
If you have any questions please do not hesitate to email or call us +31 (0)24 350 08 09
