Trymax NEO 2400 series

Trymax NEO 2400 series

The NEO 2400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment.

The NEO 2400 platform can be configured with any of the available Trymax NEO process modules and is compatible with the substrates up to 200mm in diameter.

This platform can be used as a full bridge tool with the compatibility to run substrates of different type and diameter up to 200mm.

All specifications & features


- 100 / 150 / 200mm substrate size configurable
- 4 integrated SMIF indexer or 4 open cassette stations
- 4 axis dual arm robot handling with x-track (optional)
- 2 or 4 process chambers
- 3 different process chamber technologies available:
      - Microwave downstream (2.45 GHz)
      - RF bias (13.56 MHz)
      - Dual Source (Microwave, RF bias)
- Mechanical throughput >300wph
- Compact footprint
- Very low Cost of Ownership
- Fully digital controlled, devicenet-ethernet
- Windows based industrial computers
- Cooling station and notch aligner


- Bulk resist, post LDI resist strip
- Descum processing
- Polymer removal
- Post high dose implant strip
- Silicon nitride/silicon carbide etch applications
- TaSi etch
- MEMS applications
- Advanced packaging processing (PR, PI, BCB, PBO)
- RF filter BAW/SAW resist processing


- SEMI S2-01
- SEMI S8-01
- CE EU-RoHs
- UL (optional)