SEMI European 3D & Systems Summit

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.

The summit will focus on high reliability and high performance of disruptive applications like Mobile and IoT. Invited distinguished global industry speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

2020 Main Topics and Highlights

  • 3DIC Through-Silicon-Via (TSV) technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked dies and stacked wafers
  • 3D alternative technologies
  • 5G Applications
  • uLED and photonics applications
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities