Innovative Solutions

Leading edge plasma-based systems for wafer manufacturing from 3’’ up to 12’’

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From Front End to Back End for Analog, Digital, Power, RF, MEMS, Compound Semiconductor and Wafer Level Packaging

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Expert in plasma

Trymax developed a strong expertise in plasma equipment and processes over the last 20 years. With more than 300 NEO systems installed worldwide, Trymax solutions are:

  • Delivering high performances
  • Recognized as highly reliable
  • Demonstrating low Cost of Ownership
  • Requiring very limited maintenance
  • Compact with reduced footprint
  • Capable of managing multiple wafer sizes and substrates materials
  • Built with state of the art components, interfaces, and software

Our applications Our solutions

Wide range of applications

Trymax has a wide portfolio of plasma technologies to fit the customer and application needs.

  • Photoresist bulk ashing
  • High dose implant stripping
  • Descum
  • Non-critical isotropic etching
  • Polymer removal post DRIE in cavities or TSV
  • Sacrificial layer release
  • Various surface treatments
  • Photoresist UV curing
  • UV charge erase

Our solutions are NEO series

Want to know more about our applications, technologies and products?

Our team is more than happy to answer any questions and discuss how we can help you. Do not hesitate to contact us today.

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