Our customers are using our equipment to address a wide range of applications during the semiconductor manufacturing process. Companies involved in CMOS, Power, RF, MEMS, LED, as well as Wafer Level Packaging can benefit from our solutions. Various types of materials, wafer sizes and thicknesses could be processed on our NEO series. The 2 main categories of applications we are addressing are:
- Ashing, descum, light etching, surface preparation and cleaning
- UV photoresist curing and device charge erase
Ashing, Descum, Etching, Surface Preparation & Cleaning
Trymax offers plasma solutions for ashing, descum, light etching, surface preparation, and cleaning. All these applications are using dry and environmental-friendly processes.
Ashing: Consists in stripping the photo resist. Ashing is usually performed after ion implantation or etching.
Descum: Removing remaining photoresist or polyimide on wafers for front end or wafer level packaging fabs.
Etching: Materials such as Si3N4, SiO2 and Poly-Si can efficiently be isotropically etched in a cost-effective manner.
Surface modification: Wide range of possibilities such as surface activation before wet etch to improve etch process step, surface adhesion enhancement before deposition, and many more.
Cleaning: wide range of cleaning possibilities. For instance, plasma cleaning could be performed after wet etch to complete the cleaning step or after DRIE to remove some polymer from the cavity or the via.
UV curing and charge erase
Trymax offers UV solutions for curing of the photoresist and erasing of charges built-up in devices during the manufacturing processes.
UV curing exhibits various benefits over thermal baking of the resist such as the photo stabilization of the photo-resist prior ion implantation or etch to improve the CD control, uniformity, selectivity, and overall stripping. UV irradiation is as well a powerful way to efficiently neutralize charges at floating gates.